We're thrilled to announce the return of GamesBeat Next, hosted in San Francisco this October, where we will explore the ...

Glass substrates possess mechanical, physical, and optical properties that allow for more transistors to be connected in a package.

View the full release here: "After a decade of research, Intel has achieved industry-leading glass substrates for advanced ...

Intel has announced one of the industry’s first glass substrates for next-generation advanced packaging, planned for the ...

Intel has revealed more details on its "breakthrough" glass substrate technology - a new way to manufacture processors that ...

Intel's latest gambit to keep Moore's Law on life support involves ditching organic substrates — the intermediary through ...

Intel today formally confirmed that it would use glass substrates for advanced packaging in the second half of this decade.

Intel showed off the chip company's latest code-named "Meteor Lake" processor with an AI-based neural processing unit.

In a significant stride towards the future of computing, Intel has unveiled one of the industry's pioneering glass substrates for next-generation advanced ...

Glass substrates help overcome limitations of organic materials by enabling an order of magnitude improvement in design rules needed for future data centers and AI products. SANTA CLARA, Calif.

Intel is aiming for 1 trillion transistors on a package by 2030. Glass substrates as well as other packaging technologies like Intel’s embedded multi-die interconnect bridge (EMIB) and Foveros chip ...

Glass substrates help overcome limitations of organic materials by enabling an order of magnitude improvement in design rules needed for future data centers and AI products. What’s New: Intel ...